Application guide

Tape Selection for Electronics Assembly: ESD, Thermal, and Miniature Bonding

Choose tape for electronics assembly by ESD safety, thermal conductivity, bond strength, and reworkability. Covers PCB masking, component bonding, and heat dissipation.

6 min read

ESD-safe tape protects sensitive components

Electronics assembly requires tape with controlled surface resistivity to prevent electrostatic discharge (ESD) damage to ICs, sensors, and PCBs. ESD-safe tape dissipates static charges safely without generating its own triboelectric charge.

Confirm the tape meets IEC 61340-5-1 or ANSI/ESD S20.20 for ESD protection. For PCB masking during soldering, choose a tape that withstands 260°C for 10 seconds without adhesive residue.

Thermally conductive tape replaces mechanical clips

Thermally conductive double-sided tape bonds heat sinks, LEDs, and power modules while transferring heat away from the component. The tape fills air gaps and provides electrical insulation between the component and the heat sink.

Choose the tape by thermal conductivity (W/m·K), bond strength, and service temperature. Thicker tapes fill larger gaps but have higher thermal resistance. Confirm the tape meets UL 94 V-0 for flame retardancy.

Miniature bonding for displays and sensors

Small displays, touch panels, and sensors require thin, high-bond tape with precise die-cut accuracy. Transfer tape or thin film tape with a PET carrier provides consistent thickness and clean edges.

Confirm the tape bonds to glass, PC, or PMMA without optical distortion. For rework, choose a tape that can be removed with heat or solvent without damaging the substrate. Browse transfer tape products or send an enquiry.