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TESA 60615 Bond & Detach Tape 0.15mm for Easy Component Removal

Home/Products/TESA 60615 Bond & Detach Tape 0.15mm for Easy Component Removal
TESA 60615 Bond & Detach Tape 0.15mm for Easy Component Removal
TESA 60615 Bond & Detach Tape 0.15mm for Easy Component Removal view 1TESA 60615 Bond & Detach Tape 0.15mm for Easy Component Removal view 2

TESA 60615 Bond & Detach Tape 0.15mm for Easy Component Removal

Discover TESA 60615 Bond & Detach Tape, 0.15mm thick for effortless component removal. Ideal for electronics assembly and repairs. Shop now!

Place of OriginGuangdong, China
Brand NameSEKISUI / 3M / TESA / custom equivalent
Product FormRoll, sheet, slit roll, or die-cut part
Custom ServiceDie cutting, laminating, printing, rewinding, sheeting, slitting
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Product Details

Discover TESA 60615 Bond & Detach Tape, 0.15mm thick for effortless component removal. Ideal for electronics assembly and repairs. Shop now!

Send the exact model, required width, length, thickness, monthly usage, destination, and application surface. Our team will confirm availability, alternatives, sample support, and quotation details.